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TB62702P/F
TOSHIBA Bi-CMOS INTEGRATED CIRCUIT SILICON MONOLITHIC
TB62702P,TB62702F
10BIT SERIAL-IN PARALLEL-OUT SHIFT REGISTER / LATCH / 10SEGMENT LED DRIVERS
The TB62702P, TB62702F are specifically designed for 10-Segment LED Drivers and LED display. And these are monolithic integrated circuits designed to be used together with Bi-CMOS (DMOS) integrated circuit. The devices consist of a 10bit shift Register and 10bit Latches, and 10bit DMOS structures.
TB62702P
FEATURES
10bit serial-in parallel-out shift register / latch / 10segment LED driver (Bi-CMOS process) CMOS compatible inputs Open-drain DMOS outputs Low steady-state power consumption Serial data output for cascade operation Packge ; P-type DIP-20-P-300A F-type SOP-20-P-300 Weight DIP20-P-300-2.54A: 2.25 g (typ.) SOP20-P-300-1.27: 0.48 g (typ.)
TB62702F
PIN CONNECTION (TOP VIEW)
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BLOCK DIAGRAM
ABSOLUTE MAXIMUM RATINGS (Ta = 25C, VSS = 0 V)
CHARACTERISTIC Supply Voltage Input Voltage Output Drain-Source Voltage Output Current Power Dissipation Operating Temperature Storage Temperature P F SYMBOL VDD VIN VOUT IOUT PD (Note 1) Topr Tstg RATING -0.3~7.0 -0.3~VDD +0.3 -0.4~30 30 1.47 0.96 (Note 2) -40~85 -55~150 UNIT V V V mA / bit W C C
Note 1: Delated above 25C in the proportion of 11.7 mW / C(P-type), 7.7 mW / C(F-type). Note 2: On Glass Epoxy (50 x 50 x 1.6mm Cu 40%)
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RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C, VSS = 0 V)
CHARACTERISTIC Supply Voltage "H" Level Input Voltage "L" Level Output Drain-Source Voltage Output Current Power Dissipation P F VIL VOUT IOUT PD Duty = 100%, All output on (Note 1) SYMBOL VDD VIH CONDITION MIN 4.5 0.7 VDD 0 TYP. 5 MAX 5.5 VDD 0.3 VDD 30 24 760 470 V UNIT V
V mA / ch mW
Note 1: On Glass Epoxy (50 x 50 x 1.6 mm Cu 40%)
ELECTRICAL CHARACTERISTICS (Ta = -40~85C, VDD = 4.5~5.5 V, VSS = 0 V)
CHARACTERISTIC "L" Level Output Voltage "L" Level "L" Level "L" Level Output Resistor SYMBOL VDS1 VDS1 VDS2 VDS2 RON IOZ1 Output Leakage Current IOZ2 Input Current "H" Level Output Current "L" Level "H" Level Input Voltage "L" Level Operating Supply Current Standby Supply Current VIL IDD1 IDD2 fCLK = 5 MHz NO loads, 1 bit IOL VIH IIN IIL IOH TEST CIR- CUIT TEST CONDITION IOUT = 15 mA, Ta = 25C IOUT = 15 mA IOUT = 26 mA, Ta = 25C IOUT = 26 mA Ta = 25C, IOUT = 26 mA VOUT = 30 V, EN = "L" 1 bit VOUT = 30 V, EN = "L" 10 bit VIN = VDD or VSS ENABLE, VIN = VSS S-OUT VDS = 4.6 V, VDD = 5.0 V S-OUT VDS = 0.4 V, VDD = 5.0 V MIN -27.5 -400 400 0.7 VDD 0 TYP. -55.0 -600 600 MAX 0.18 0.27 0.31 0.47 12 10 A 1 1 -110.0 A VDD 0.3 VDD 1500 500 V A V UNIT
A
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SWITCHING CHARACTERISTICS
CHARACTERISTIC CLK- OUTn
Propagation Delay Time (Low-to-High)
(Ta = 25C, VDD = 5 V, VOUT = 30 V, RL = 1150 , CL = 15 pF, "H" = VIH, "L" = VIL)
SYMBOL TEST CONDITION
LAT = "H", CLR = "H", EN = "H"
tpLH
LAT = "H", EN = "H"
MIN
TYP.
MAX
250
250
UNIT
CLK- OUTn
LAT - OUTn
CLR = "H", EN = "H" LAT = "H", CLR = "H" LAT = "H", CLR = "H", EN = "H"

200 150 250 200 150
ns
EN- OUTn CLK- OUTn Propagation Delay Time (High-to-Low) LAT - OUTn EN- OUTn tpHL
CLR = "H", EN = "H" LAT = "H", CLR = "H"
ns
Set Up Time
CLK- LAT
tsetup (L) tsetup (D) thold (L) thold (D) tw CLK tw LAT tw CLR tw EN tor tr tof tf fMAX1 fMAX2 OUTn S-OUT, VSS = 0V OUTn S-OUT, VSS = 0V

5 6
8 12
50 35 105 50 100 50 50 400 1000 50 150 50 MHz ns ns ns
CLK-S-IN CLK- LAT CLK-S-IN
Hold Time Clock Pulse Width Latch Pulse Width Clear Pulse Width Enable Pulse Width Output Rise Time
Output Fall Time
Maximum Clock Frequency
Duty = 50% Cascade connected Duty = 50%
RECOMMENDED TIMING CONDITIONS (Ta = -40~85C, VDD = 4.5~5.5 V, VSS = 0)
CHARACTERISTIC Clock Pulse Width Enable Pulse Width Latch Pulse Width Clear Pulse Width Data Set Up Time Data Hold Time SYMBOL tw CLK tw EN tw LAT tw CLR tsetup thold TEST CONDITION MIN 100 400 100 100 100 150 TYP. MAX UNIT ns s ns ns ns ns
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TIMING DIAGRAM
1. Input timing diagram
2. Propagation delay time
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PRECUATIONS for USING Utmost care is necessary in the design of the output line, VCC (VDD) and GND (L-GND, P-GND) line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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Package Dimensions
Weight: 2.25 g (typ.)
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Package Dimensions
Weight: 0.48 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
(2)
(3)
(4)
(5)
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Points to Remember on Handling of ICs
(1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
(2)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice. 021023_D
060116EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
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